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Texas Instruments SN74LVC1G17YZVR

IC BUF NON-INVERT 5.5V 4DSBGA
part number has RoHS
Manufacturer # :SN74LVC1G17YZVR
Manufacturer :Texas Instruments
Dasenic # :SN74LVC1G17YZVR-DS
Customer # :
Description : IC BUF NON-INVERT 5.5V 4DSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0972$ 0.1
In Stock: 24933
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0972
Total :$ 0.10
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SN74LVC1G17YZVR information

  • Texas Instruments SN74LVC1G17YZVR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:4-XFBGA, DSBGA
  • Input Type:Schmitt Trigger
  • Output Type:Push-Pull
  • Supplier Device Package:4-DSBGA (0.88x0.88)
  • Number of Elements:1
  • Voltage - Supply:1.65V ~ 5.5V
  • Logic Type:Buffer, Non-Inverting
  • Number of Bits per Element:1
  • Current - Output High, Low:32mA, 32mA
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC1G17YZVR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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