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Texas Instruments SN74HC273ANS
IC FF D-TYPE SNGL 8BIT 20SO
Manufacturer # :SN74HC273ANS
Manufacturer :Texas Instruments
Dasenic # :SN74HC273ANS-DS
Datasheet :
SN74HC273ANS Datasheet
SN74HC273ANS DatasheetCustomer # :
Description : IC FF D-TYPE SNGL 8BIT 20SO
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| Quantity | Unit Price | Total |
In Stock: 10
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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SN74HC273ANS information
Texas Instruments SN74HC273ANS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Type:D-Type
- Functions:Master Reset
- Supplier Device Package:20-SO
- Series:74HC
- Operating Temperature:-40°C ~ 85°C
- Voltage- Supply:2V ~ 6V
- Output Type:Non-Inverted
- Clock Frequency:32 MHz
- Numberof Elements:1
- Current- Output High Low:5.2mA, 5.2mA
- Numberof Bitsper Element:8
- Current- Quiescent( Iq):8 µA
- Max Propagation Delay@ V Max C L:25ns @ 6V, 50pF
- Trigger Type:Positive Edge
- Input Capacitance:3 pF
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74HC273ANS provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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