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Texas Instruments SN74F373N
IC OCT D-TYPE LATCH 20-DIP
Manufacturer # :SN74F373N
Manufacturer :Texas Instruments
Dasenic # :SN74F373N-DS
Datasheet :
SN74F373N Datasheet
SN74F373N DatasheetCustomer # :
Description : IC OCT D-TYPE LATCH 20-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 19+ | $ 0.1272 | $ 2.42 |
| 2500+ | $ 0.1270 | $ 317.5 |
| 5000+ | $ 0.1269 | $ 634.5 |
| 25000+ | $ 0.1267 | $ 3167.5 |
In Stock: 11589
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1272
Total :$ 0.13
Delivery :
Payment :
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SN74F373N information
Texas Instruments SN74F373N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Latches
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:20-DIP (0.300", 7.62mm)
- Output Type:Tri-State
- Supplier Device Package:20-PDIP
- Voltage - Supply:4.5V ~ 5.5V
- Logic Type:D-Type Transparent Latch
- Current - Output High, Low:3mA, 24mA
- Circuit:8:8
- Independent Circuits:1
- Delay Time - Propagation:8.6ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74F373N provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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