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Texas Instruments SN74F163ANSR
Manufacturer # :SN74F163ANSR
Manufacturer :Texas Instruments
Dasenic # :SN74F163ANSR-DS
Datasheet : SN74F163ANSR Datasheet
Customer # :
Description : IC COUNTER 4BIT BIN SYNC 16SO
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In Stock: 8520
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.1755
Total :$ 0.18
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SN74F163ANSR information
Texas Instruments SN74F163ANSR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Counters, Dividers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.209", 5.30mm Width)
- Direction:Up
- Supplier Device Package:16-SO
- Number of Elements:1
- Voltage - Supply:4.5 V ~ 5.5 V
- Logic Type:Binary Counter
- Number of Bits per Element:4
- Reset:Synchronous
- Timing:Synchronous
- Count Rate:100 MHz
- Trigger Type:Positive Edge
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74F163ANSR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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