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Texas Instruments SN74CBTLV3383DBQR

IC BUS FET EXCHG SW 5X2:2 24SSOP
part number has RoHS
Manufacturer # :SN74CBTLV3383DBQR
Manufacturer :Texas Instruments
Dasenic # :SN74CBTLV3383DBQR-DS
Customer # :
Description : IC BUS FET EXCHG SW 5X2:2 24SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.6840$ 0.68
10+$ 0.4185$ 4.19
100+$ 0.3312$ 33.12
500+$ 0.3141$ 157.05
1000+$ 0.2997$ 299.7
In Stock: 7050
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.684
Total :$ 0.68
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SN74CBTLV3383DBQR information

  • Texas Instruments SN74CBTLV3383DBQR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:24-SSOP (0.154", 3.90mm Width)
  • Type:Bus FET Exchange Switch
  • Supplier Device Package:24-SSOP
  • Voltage - Supply:2.3V ~ 3.6V
  • Voltage Supply Source:Single Supply
  • Current - Output High, Low:-
  • Circuit:5 x 2:2
  • Independent Circuits:1
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74CBTLV3383DBQR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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