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Texas Instruments SN74AUP1G80DSFR
Manufacturer # :SN74AUP1G80DSFR
Manufacturer :Texas Instruments
Dasenic # :SN74AUP1G80DSFR-DS
Datasheet : SN74AUP1G80DSFR Datasheet
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Description : IC FF D-TYPE SNGL 1BIT 6SON
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In Stock: 5586
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.0203
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SN74AUP1G80DSFR information
Texas Instruments SN74AUP1G80DSFR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:6-XFDFN
- Type:D-Type
- Output Type:Inverted
- Supplier Device Package:6-SON (1x1)
- Number of Elements:1
- Voltage - Supply:0.8V ~ 3.6V
- Clock Frequency:260 MHz
- Number of Bits per Element:1
- Current - Output High, Low:4mA, 4mA
- Max Propagation Delay @ V, Max C L:6.4ns @ 3.3V, 30pF
- Current - Quiescent ( Iq):500 nA
- Trigger Type:Positive Edge
- Input Capacitance:1.5 pF
- Function:Standard
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AUP1G80DSFR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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