Name: SN74ALVCH16374DGVR
Brand: Texas Instruments
SKU: DS-5882222
Price: 0.157 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments SN74ALVCH16374DGVR

IC FF D-TYPE DUAL 8BIT 48TVSOP

Manufacturer # :SN74ALVCH16374DGVR

Manufacturer :Texas Instruments

Dasenic # :SN74ALVCH16374DGVR-DS

Datasheet :

SN74ALVCH16374DGVR Datasheet

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Description : IC FF D-TYPE DUAL 8BIT 48TVSOP

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In Stock: 9456

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SN74ALVCH16374DGVR information

Texas Instruments SN74ALVCH16374DGVR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Logic - Flip Flops
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:48-TFSOP (0.173", 4.40mm Width)
Type:D-Type
Output Type:Tri-State, Non-Inverted
Supplier Device Package:48-TVSOP
Number of Elements:2
Voltage - Supply:1.65V ~ 3.6V
Clock Frequency:150 MHz
Number of Bits per Element:8
Current - Output High, Low:24mA, 24mA
Max Propagation Delay @ V, Max C L:4.2ns @ 3.3V, 50pF
Current - Quiescent ( Iq):40 µA
Trigger Type:Positive Edge
Input Capacitance:3 pF
Function:Standard
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments SN74ALVCH16374DGVR
Datasheet:
SN74ALVCH16374DGVR,

Texas Instruments SN74ALVCH16374DGVR Environmental and export classification status description
The Texas Instruments SN74ALVCH16374DGVR is a 16-bit D-type flip-flop that features separate clock and output enable (OE) inputs. The flip-flop is part of the ALVCH series, known for its low voltage and high-speed operation. Functions: - Each flip-flop features a clock input (CP) to latch data and an OE input to enable/disable the outputs. - The device operates at 1.65-V to 3.6-V VCC range, making it suitable for low-power applications. Applications: - Address and Data Register Storage - Clock and Storage Registers - Parallel Data Transfer - FIFO Buffer Alternative Components: - SN74ALVC16374 - SN74ALVCH162831 - SN74ALVCH162834 Embedded Modules: - Data latches - Clock distributor - Data storage elements Related Q&A: 1. What is the power consumption of the SN74ALVCH16374DGVR? - The power consumption typically depends on the operating conditions but ranges from low to moderate due to the low voltage design. 2. Can the SN74ALVCH16374DGVR handle high-speed data transfer? - Yes, this flip-flop is designed for high-speed operation and can handle fast data transfers efficiently. 3. Is the SN74ALVCH16374DGVR suitable for battery-powered applications? - Yes, the wide operating voltage range and low power consumption make it suitable for battery-powered applications. 4. Does the SN74ALVCH16374DGVR have any built-in security features for data protection? - This flip-flop primarily focuses on data storage and transfer functions; additional security features would need to be implemented externally if required. 5. Can I cascade multiple SN74ALVCH16374DGVR devices together for expanded functionality? - Yes, you can cascade multiple devices together to increase the number of flip-flops and achieve more complex logic functions.

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SN74ALVCH16374DGVR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.