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Texas Instruments SN74AHCT08DBR
Manufacturer # :SN74AHCT08DBR
Manufacturer :Texas Instruments
Dasenic # :SN74AHCT08DBR-DS
Datasheet : SN74AHCT08DBR Datasheet
Customer # :
Description : 4-ch, 2-input 4.5-V to 5.5-V high-speed (7.1 ns) AND gate with TTL-compatible inputs
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In Stock: 11700
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.243
Total :$ 0.24
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SN74AHCT08DBR information
Texas Instruments SN74AHCT08DBR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Gates and Inverters
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-SSOP (0.209", 5.30mm Width)
- Supplier Device Package:14-SSOP
- Number of Circuits:4
- Voltage - Supply:4.5V ~ 5.5V
- Number of Inputs:2
- Current - Quiescent ( Max):2 µA
- Logic Type:AND Gate
- Current - Output High, Low:8mA, 8mA
- Max Propagation Delay @ V, Max C L:7.9ns @ 5V, 50pF
- Series:74AHCT
- Base Product Number:74AHCT08
- Input Logic Level - Low:0.8V
- Input Logic Level - High:2V
- Packaging:Dasenic-Reel®
- Packaging:Cut Tape (CT)
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AHCT08DBR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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