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Texas Instruments SN74AHC1G04DBV3
IC INVERTER 1CH 1-INP SOT23-5
Manufacturer # :SN74AHC1G04DBV3
Manufacturer :Texas Instruments
Dasenic # :SN74AHC1G04DBV3-DS
Datasheet :
SN74AHC1G04DBV3 Datasheet
SN74AHC1G04DBV3 DatasheetCustomer # :
Description : IC INVERTER 1CH 1-INP SOT23-5
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0367 | $ 0.04 |
In Stock: 12900
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0367
Total :$ 0.04
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SN74AHC1G04DBV3 information
Texas Instruments SN74AHC1G04DBV3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
- Product Status:Active
- Supplier Device Package:SOT-23-5
- Series:74AHC
- Operating Temperature:-40°C ~ 125°C
- Voltage- Supply:2V ~ 5.5V
- Numberof Circuits:1
- Numberof Inputs:1
- Current- Quiescent( Max):1 µA
- Logic Type:Inverter
- Current- Output High Low:8mA, 8mA
- Max Propagation Delay@ V Max C L:7.5ns @ 5V, 50pF
- Input Logic Level- Low:0.5V ~ 1.65V
- Input Logic Level- High:1.5V ~ 3.85V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AHC1G04DBV3 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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