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Texas Instruments SN65LVDS18DRFR
Manufacturer # :SN65LVDS18DRFR
Manufacturer :Texas Instruments
Dasenic # :SN65LVDS18DRFR-DS
Datasheet : SN65LVDS18DRFR Datasheet
Customer # :
Description : IC REDRIVER 1CH 2GBPS 8WSON
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In Stock: 14445
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.376
Total :$ 2.38
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SN65LVDS18DRFR information
Texas Instruments SN65LVDS18DRFR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Signal Buffers, Repeaters, Splitters
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-WFDFN Exposed Pad
- Current - Supply:30mA
- Type:Buffer, ReDriver
- Number of Channels:1
- Supplier Device Package:8-WSON (2x2)
- Data Rate ( Max):2Gbps
- Output:LVDS
- Voltage - Supply:2.375V ~ 3.6V
- Input:PECL
- Delay Time:460ps
- Signal Conditioning:-
- Capacitance - Input:-
- Applications:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN65LVDS18DRFR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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