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Texas Instruments SN65LVDS122PW
Manufacturer # :SN65LVDS122PW
Manufacturer :Texas Instruments
Dasenic # :SN65LVDS122PW-DS
Datasheet : SN65LVDS122PW Datasheet
Customer # :
Description : IC CROSSPOINT SW 1 X 2:2 16TSSOP
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In Stock: 3108
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.411
Total :$ 3.41
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SN65LVDS122PW information
Texas Instruments SN65LVDS122PW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Type:Crosspoint Switch
- Supplier Device Package:16-TSSOP
- Voltage - Supply:3V ~ 3.6V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:-
- Circuit:1 x 2:2
- Independent Circuits:1
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN65LVDS122PW provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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