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Texas Instruments SN65ALS1176D
Manufacturer # :SN65ALS1176D
Manufacturer :Texas Instruments
Dasenic # :SN65ALS1176D-DS
Datasheet : SN65ALS1176D Datasheet
Customer # :
Description : RS-422/RS-485 Interface IC Differential Bus Transceiver
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In Stock: 4254
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.888
Total :$ 3.89
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SN65ALS1176D information
Texas Instruments SN65ALS1176D technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Obsolete
- Operating Temperature:-25°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Type:Transceiver
- Supplier Device Package:8-SOIC
- Voltage - Supply:4.75V ~ 5.25V
- Protocol:RS422, RS485
- Number of Drivers/ Receivers:1/1
- Duplex:Half
- Receiver Hysteresis:60 mV
- Data Rate:35Mbd
- Base Product Number:65ALS1176
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN65ALS1176D provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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