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  • Texas Instruments SMV512K32HFG

    IC SRAM 16MBIT PARALLEL 76CFP
  • part number has RoHS
  • Mfr.Part # :SMV512K32HFG
  • Manufacturer :Texas Instruments
  • Dasenic # :SMV512K32HFG-DS
  • Datasheet :pdf download SMV512K32HFG Datasheet
  • Description : IC SRAM 16MBIT PARALLEL 76CFP
  • Package :-
  • Quantity :
    Unit Price : $ 12817.54Total : $ 12817.54
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 2640
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
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Texas Instruments SMV512K32HFG technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Memory Integrated Circuit
Product Status:Obsolete
Operating Temperature:-55°C ~ 125°C (TC)
Mounting Type:Surface Mount
Package / Case:76-CBQFP Bumpered
Technology:SRAM
Supplier Device Package:76-CFP (45.72x51.31)
Memory Size:16Mb (512K x 32)
Memory Type:Volatile
Voltage - Supply:1.7V ~ 3.6V
Clock Frequency:-
Access Time:20 ns
Memory Format:SRAM
Memory Interface:Parallel
Write Cycle Time - Word, Page:20ns
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:OBSOLETE
HTS US:8542.32.0041
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SMV512K32HFG provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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