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Texas Instruments SCANSTA112SMX/NOPB

IC INTERFACE SPECIALIZED 100FBGA
part number has RoHS
Manufacturer # :SCANSTA112SMX/NOPB
Manufacturer :Texas Instruments
Dasenic # :SCANSTA112SMX/NOPB-DS
Customer # :
Description : IC INTERFACE SPECIALIZED 100FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 27.0900$ 270.9
1000+$ 18.0600$ 18060
In Stock: 2371
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.09
Total :$ 27.09
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SCANSTA112SMX/NOPB information

  • Texas Instruments SCANSTA112SMX/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Specialized
  • Product Status:Not For New Designs
  • Mounting Type:Surface Mount
  • Package / Case:100-LFBGA
  • Interface:IEEE 1149.1
  • Supplier Device Package:100-FBGA (10x10)
  • Voltage - Supply:3V ~ 3.6V
  • Applications:Testing Equipment
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SCANSTA112SMX/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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