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Texas Instruments RF37S114HTFJB

RFID TAG R/W 13.56MHZ INLAY
part number has RoHS
Manufacturer # :RF37S114HTFJB
Manufacturer :Texas Instruments
Dasenic # :RF37S114HTFJB-DS
Customer # :
Description : RFID TAG R/W 13.56MHZ INLAY
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.7380$ 0.74
10+$ 0.5157$ 5.16
100+$ 0.4014$ 40.14
500+$ 0.3753$ 187.65
1000+$ 0.3240$ 324
In Stock: 27401
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.738
Total :$ 0.74
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RF37S114HTFJB information

  • Texas Instruments RF37S114HTFJB technical specifications, attributes, parameters.
  • Category:RF and Wireless/RFID Transponders, Tags
  • Product Status:Active
  • Operating Temperature:-25°C ~ 70°C
  • Size / Dimension:0.157" L x 0.157" W (4.00mm x 4.00mm)
  • Frequency:13.56MHz
  • Technology:Passive
  • Style:Inlay
  • Memory Type:Read/Write
  • Standards:ISO 15693, ISO 18000-3
  • Writable Memory:256b (User)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
RF37S114HTFJB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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