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Texas Instruments PCM2903CDBR
Manufacturer # :PCM2903CDBR
Manufacturer :Texas Instruments
Dasenic # :PCM2903CDBR-DS
Datasheet : PCM2903CDBR Datasheet
Customer # :
Description : IC STERO AUD CODEC W/USB 28SSOP
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In Stock: 9600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.8222
Total :$ 6.82
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PCM2903CDBR information
Texas Instruments PCM2903CDBR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Active
- Operating Temperature:-25°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.209", 5.30mm Width)
- Type:Stereo Audio
- Supplier Device Package:28-SSOP
- Resolution ( Bits):16 b
- Data Interface:USB
- Voltage - Supply, Analog:3V ~ 3.6V
- Voltage - Supply, Digital:3V ~ 3.6V
- Number of A D Cs / D A Cs:2 / 2
- Sigma Delta:Yes
- S/ N Ratio, A D Cs / D A Cs (db) Typ:89 / 96
- Dynamic Range, A D Cs / D A Cs (db) Typ:89 / 93
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PCM2903CDBR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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