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Texas Instruments PCM2704DBG4
Manufacturer # :PCM2704DBG4
Manufacturer :Texas Instruments
Dasenic # :PCM2704DBG4-DS
Datasheet : PCM2704DBG4 Datasheet
Customer # :
Description : IC AUDIO 16BIT 48K 28SSOP
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In Stock: 2357
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 10.94
Total :$ 10.94
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PCM2704DBG4 information
Texas Instruments PCM2704DBG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Not For New Designs
- Operating Temperature:-25°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.209", 5.30mm Width)
- Type:Audio
- Number of Channels:1
- Supplier Device Package:28-SSOP
- Voltage - Supply:3V ~ 3.6V, 5V
- Resolution ( Bits):16 b
- Sampling Rate ( Per Second):48k
- Data Interface:SPI, USB
- Voltage Supply Source:Analog and Digital
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PCM2704DBG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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