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Texas Instruments PC16550DN
IC UART WITH FIFO 40-DIP
Manufacturer # :PC16550DN
Manufacturer :Texas Instruments
Dasenic # :PC16550DN-DS
Datasheet :
PC16550DN Datasheet
PC16550DN DatasheetCustomer # :
Description : IC UART WITH FIFO 40-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 8.0550 | $ 8.06 |
| 10+ | $ 7.6410 | $ 76.41 |
| 100+ | $ 7.1550 | $ 715.5 |
In Stock: 1552
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.055
Total :$ 8.05
Delivery :
Payment :
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PC16550DN information
Texas Instruments PC16550DN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - UARTs (Universal Asynchronous Receiver Transmitter)
- Product Status:Obsolete
- Features:-
- Mounting Type:Through Hole
- Package / Case:40-DIP (0.600", 15.24mm)
- Number of Channels:1, UART
- Supplier Device Package:40-DIP
- Data Rate ( Max):1.5Mbps
- Voltage - Supply:4.5V ~ 5.5V
- Protocol:-
- F I F O's:16 Byte
- With Auto Flow Control:-
- With Ir D A Encoder/ Decoder:-
- With False Start Bit Detection:Yes
- With Modem Control:Yes
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
PC16550DN provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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