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Texas Instruments OPA350PA
IC OPAMP GP 1 CIRCUIT 8DIP
Manufacturer # :OPA350PA
Manufacturer :Texas Instruments
Dasenic # :OPA350PA-DS
Datasheet :
OPA350PA Datasheet
OPA350PA DatasheetCustomer # :
Description : IC OPAMP GP 1 CIRCUIT 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 12.0400 | $ 12.04 |
In Stock: 2422
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.04
Total :$ 12.04
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OPA350PA information
Texas Instruments OPA350PA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Last Time Buy
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Current - Supply:5.2mA
- Output Type:Rail-to-Rail
- Supplier Device Package:8-PDIP
- Number of Circuits:1
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:40 mA
- Slew Rate:22V/µs
- Gain Bandwidth Product:38 MHz
- Current - Input Bias:0.5 pA
- Voltage - Input Offset:150 µV
- Voltage - Supply Span ( Min):2.5 V
- Voltage - Supply Span ( Max):5.5 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
OPA350PA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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