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Texas Instruments OPA228PA
Manufacturer # :OPA228PA
Manufacturer :Texas Instruments
Dasenic # :OPA228PA-DS
Datasheet : OPA228PA Datasheet
Customer # :
Description : IC OPAMP GP 1 CIRCUIT 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 8901
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.169
Total :$ 2.17
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Payment :
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OPA228PA information
Texas Instruments OPA228PA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Current - Supply:3.7mA
- Output Type:-
- Supplier Device Package:8-PDIP
- Number of Circuits:1
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:45 mA
- Slew Rate:11V/µs
- Gain Bandwidth Product:33 MHz
- Current - Input Bias:2.5 nA
- Voltage - Input Offset:10 µV
- Voltage - Supply Span ( Min):5 V
- Voltage - Supply Span ( Max):36 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
OPA228PA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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