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Texas Instruments ONET8501VRGPR
Manufacturer # :ONET8501VRGPR
Manufacturer :Texas Instruments
Dasenic # :ONET8501VRGPR-DS
Datasheet : ONET8501VRGPR Datasheet
Customer # :
Description : IC LASER DRVR 11.3GB 3.6V 20QFN
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In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.1088
Total :$ 1.11
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ONET8501VRGPR information
Texas Instruments ONET8501VRGPR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Laser Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-VFQFN Exposed Pad
- Current - Supply:90 mA
- Type:Laser Diode Driver (Fiber Optic)
- Number of Channels:1
- Supplier Device Package:20-QFN (4x4)
- Voltage - Supply:2.95V ~ 3.6V
- Data Rate:11.3Gbps
- Current - Modulation:24mA
- Current - Bias:20 mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ONET8501VRGPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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