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Texas Instruments OMAPL138EZCEA3E
Manufacturer # :OMAPL138EZCEA3E
Manufacturer :Texas Instruments
Dasenic # :OMAPL138EZCEA3E-DS
Datasheet : OMAPL138EZCEA3E Datasheet
Customer # :
Description : IC MPU OMAP-L1X 375MHZ 361NFBGA
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In Stock: 9145
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 29.8673
Total :$ 29.87
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OMAPL138EZCEA3E information
Texas Instruments OMAPL138EZCEA3E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TJ)
- Package / Case:361-LFBGA
- Supplier Device Package:361-NFBGA (13x13)
- Voltage - I/ O:1.8V, 3.3V
- Speed:375MHz
- Core Processor:ARM926EJ-S
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Signal Processing; C674x, System Control; CP15
- R A M Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:LCD
- Ethernet:10/100Mbps (1)
- S A T A:SATA 3Gbps (1)
- U S B:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Security Features:Boot Security, Cryptography
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
OMAPL138EZCEA3E provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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