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Texas Instruments NE5534P
Manufacturer # :NE5534P
Manufacturer :Texas Instruments
Dasenic # :NE5534P-DS
Datasheet : NE5534P Datasheet
Customer # :
Description : IC OPAMP GP 1 CIRCUIT 8DIP
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In Stock: 43956
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4383
Total :$ 0.44
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NE5534P information
Texas Instruments NE5534P technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Current - Supply:4mA
- Output Type:-
- Supplier Device Package:8-PDIP
- Number of Circuits:1
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:38 mA
- Slew Rate:13V/µs
- Gain Bandwidth Product:10 MHz
- Current - Input Bias:500 nA
- Voltage - Input Offset:500 µV
- Voltage - Supply Span ( Min):10 V
- Voltage - Supply Span ( Max):30 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NE5534P provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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