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Texas Instruments MSPM0L1305TDGS20R
Manufacturer # :MSPM0L1305TDGS20R
Manufacturer :Texas Instruments
Dasenic # :MSPM0L1305TDGS20R-DS
Datasheet : MSPM0L1305TDGS20R Datasheet
Customer # :
Description : 32-MHz Arm® Cortex®-M0+ MCU with 32-KB flash, 4-KB SRAM, 12-bit ADC, comparator, OPA
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In Stock: 11998
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 1.35
Total :$ 1.35
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MSPM0L1305TDGS20R information
Texas Instruments MSPM0L1305TDGS20R technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-TFSOP (0.118", 3.00mm Width)
- Supplier Device Package:20-VSSOP
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:17
- Speed:32MHz
- Core Processor:ARM® Cortex®-M0+
- R A M Size:4K x 8
- Program Memory Type:Flash
- Core Size:32-Bit
- Connectivity:DALI, I²C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Program Memory Size:32KB (32K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.62V ~ 3.6V
- Data Converters:A/D 8x12b SAR
- Oscillator Type:External, Internal
- Packaging:Tape & Reel (TR)
- Packaging:Dasenic-Reel®
- Packaging:Cut Tape (CT)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSPM0L1305TDGS20R provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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