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Texas Instruments MSPM0L1106TRHBR
Manufacturer # :MSPM0L1106TRHBR
Manufacturer :Texas Instruments
Dasenic # :MSPM0L1106TRHBR-DS
Datasheet : MSPM0L1106TRHBR Datasheet
Customer # :
Description : 32-MHz Arm® Cortex®-M0+ MCU with 64-KB flash, 4-KB SRAM, 12-bit ADC
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In Stock: 18354
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.314
Total :$ 1.31
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MSPM0L1106TRHBR information
Texas Instruments MSPM0L1106TRHBR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Package / Case:32-VFQFN Exposed Pad
- Peripherals:DMA, PWM, WDT
- Speed:32MHz
- Connectivity:DALI, I²C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Operating Temperature:-40°C ~ 105°C (TA)
- Core Processor:ARM® Cortex®-M0+
- R A M Size:4K x 8
- Numberof I/ O:28
- Program Memory Type:Flash
- Core Size:32-Bit
- Data Converters:A/D 10x12b SAR
- Oscillator Type:Internal
- Program Memory Size:64KB (64K x 8)
- Voltage- Supply( Vcc/ Vdd):1.62V ~ 3.6V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSPM0L1106TRHBR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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