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Texas Instruments MSP430G2332IRSA16T
Manufacturer # :MSP430G2332IRSA16T
Manufacturer :Texas Instruments
Dasenic # :MSP430G2332IRSA16T-DS
Datasheet : MSP430G2332IRSA16T Datasheet
Customer # :
Description : IC MCU 16BIT 4KB FLASH 16QFN
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In Stock: 6000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.008
Total :$ 1.01
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MSP430G2332IRSA16T information
Texas Instruments MSP430G2332IRSA16T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-VQFN Exposed Pad
- Supplier Device Package:16-QFN (4x4)
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:10
- Speed:16MHz
- E E P R O M Size:-
- Core Processor:MSP430 CPU16
- R A M Size:256 x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, SPI, USI
- Program Memory Size:4KB (4K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:A/D 8x10b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430G2332IRSA16T provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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