Name: MSP430FR5722IRGER
Brand: Texas Instruments
SKU: DS-5604719
Price: 4.943 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments MSP430FR5722IRGER

IC MCU 16BIT 8KB FRAM 24VQFN

Manufacturer # :MSP430FR5722IRGER

Manufacturer :Texas Instruments

Dasenic # :MSP430FR5722IRGER-DS

Datasheet :

MSP430FR5722IRGER Datasheet

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Description : IC MCU 16BIT 8KB FRAM 24VQFN

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Quantity	Unit Price	Total
10+	$ 4.9430	$ 49.43
3000+	$ 2.7461	$ 8238.3

In Stock: 1612

MOQ :1 PCS

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Unit Price :$ 4.943

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MSP430FR5722IRGER information

Texas Instruments MSP430FR5722IRGER technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:24-VFQFN Exposed Pad
Supplier Device Package:24-VQFN (4x4)
Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
Number of I/ O:17
Speed:8MHz
E E P R O M Size:-
Core Processor:MSP430 CPUXV2
R A M Size:1K x 8
Program Memory Type:FRAM
Core Size:16-Bit
Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
Program Memory Size:8KB (8K x 8)
Voltage - Supply ( Vcc/ Vdd):2V ~ 3.6V
Data Converters:-
Oscillator Type:Internal
EU RoHS Status:ROHS3 Compliant
MSL Rating:2 (1 Year,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.31.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Texas Instruments MSP430FR5722IRGER
Datasheet:
MSP430FR5722IRGER,

Texas Instruments MSP430FR5722IRGER Environmental and export classification status description
The Texas Instruments MSP430FR5722IRGER is an ultra-low-power microcontroller (MCU) based on the MSP430FRx FRAM series. It features an integrated 16-bit RISC CPU, robust peripherals, and a wide operating voltage range, making it suitable for battery-operated and other power-sensitive applications. Functions: - Ultra-low power consumption. - Integrated non-volatile FRAM memory. - Enhanced analog and digital peripherals. - Flexible clocking options. - Security features for data protection. - Various communication interfaces. Applications: - IoT devices. - Smart meters. - Wearable devices. - Sensor nodes. - Portable medical devices. - Energy harvesting systems. Alternative Components: - Atmel/Microchip AVR series. - STMicroelectronics STM32 series. - NXP Semiconductors LPC series. - Silicon Labs EFM32 series. Embedded Modules: - Integrated ADC and DAC modules. - Communication modules like UART, SPI, I2C. - Timers and PWM modules. - Capacitive touch sensing modules. - Real-time clock (RTC) modules. Q&A: 1. What is FRAM memory, and how does it differ from traditional EEPROM or Flash memory? 2. Can the MSP430FR5722IRGER operate on a single coin cell battery for an extended period, and if so, what are the power-saving features that enable this? 3. How does the MSP430FR5722IRGER incorporate security features to protect sensitive data in IoT applications? 4. What tools or software development kits are available to streamline the development process when using the MSP430FR5722IRGER in a project? 5. In what ways can the integrated analog and digital peripherals of the MSP430FR5722IRGER be utilized in wearable technology applications for health monitoring?

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MSP430FR5722IRGER provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.