Name: MSP430F6776IPZR
Brand: Texas Instruments
SKU: DS-5606339
Price: 19.521 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments MSP430F6776IPZR

IC MCU 16BIT 256KB FLASH 100LQFP

Manufacturer # :MSP430F6776IPZR

Manufacturer :Texas Instruments

Dasenic # :MSP430F6776IPZR-DS

Datasheet :

MSP430F6776IPZR Datasheet

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Description : IC MCU 16BIT 256KB FLASH 100LQFP

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Quantity	Unit Price	Total
10+	$ 19.5210	$ 195.21
1000+	$ 13.0140	$ 13014

In Stock: 1419

MOQ :1 PCS

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Unit Price :$ 19.521

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MSP430F6776IPZR information

Texas Instruments MSP430F6776IPZR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:100-LQFP
Supplier Device Package:100-LQFP (14x14)
Peripherals:Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 7x24b Sigma Delta Converter
Number of I/ O:62
Speed:25MHz
E E P R O M Size:-
Core Processor:MSP430 CPUXV2
R A M Size:16K x 8
Program Memory Type:Flash
Core Size:16-Bit
Connectivity:I²C, IrDA, LINbus, SPI, UART/USART
Program Memory Size:256KB (256K x 8)
Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:5A992C
HTS US:8542.31.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Texas Instruments MSP430F6776IPZR
Datasheet:
MSP430F6776IPZR,

Texas Instruments MSP430F6776IPZR Environmental and export classification status description
The Texas Instruments MSP430F6776IPZR is a high-performance microcontroller from the MSP430 family, known for its low power consumption and high efficiency. It features a 16-bit RISC architecture and offers various peripherals and interfaces for efficient control applications. Functions: - 16-bit RISC CPU with up to 25 MHz clock speed - 512KB flash memory and 32KB RAM - Integrated peripherals such as ADC, DAC, timers, and communication interfaces - Low power consumption for battery-operated applications - Advanced security features for data protection Applications: - Industrial control systems - Smart meters - Home automation - Consumer electronics - IoT devices - Sensor nodes Alternative Components: - Atmel AVR microcontrollers - PIC microcontrollers from Microchip - STM32 microcontrollers from STMicroelectronics Embedded Modules: - Capacitive touch sensing modules - Wireless communication modules (Bluetooth, Wi-Fi) - LCD display modules - Motor control modules Related Q&A: 1. What makes the MSP430F6776IPZR an ideal choice for low-power applications? 2. How can the integrated security features of the MSP430F6776IPZR enhance data protection in IoT devices? 3. What programming language is commonly used to develop applications for the MSP430F6776IPZR? 4. Can the MSP430F6776IPZR interface with external sensors for data acquisition? 5. What are the key factors to consider when selecting between the MSP430F6776IPZR and other microcontrollers for a specific project?

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MSP430F6776IPZR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.