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Texas Instruments MSP430F5326TDF1
IC MCU 16BIT 96KB FLASH DIE
Manufacturer # :MSP430F5326TDF1
Manufacturer :Texas Instruments
Dasenic # :MSP430F5326TDF1-DS
Datasheet :
MSP430F5326TDF1 Datasheet
MSP430F5326TDF1 DatasheetCustomer # :
Description : IC MCU 16BIT 96KB FLASH DIE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 100+ | $ 9.1665 | $ 916.65 |
| 1000+ | $ 9.1665 | $ 9166.5 |
| 10000+ | $ 9.1665 | $ 91665 |
In Stock: 7444
MOQ :1 PCS
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Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 9.1665
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MSP430F5326TDF1 information
Texas Instruments MSP430F5326TDF1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:63
- Speed:25MHz
- E E P R O M Size:-
- Core Processor:MSP430 CPUXV2
- R A M Size:8K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Program Memory Size:96KB (96K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:A/D 12x12b
- Oscillator Type:Internal
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430F5326TDF1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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