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Texas Instruments MSP430F5326IZQE
Manufacturer # :MSP430F5326IZQE
Manufacturer :Texas Instruments
Dasenic # :MSP430F5326IZQE-DS
Datasheet : MSP430F5326IZQE Datasheet
Customer # :
Description : IC MCU 16BIT 96KB FLASH 80BGA
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In Stock: 15573
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.72
Total :$ 0.72
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MSP430F5326IZQE information
Texas Instruments MSP430F5326IZQE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:80-VFBGA
- Supplier Device Package:80-BGA MICROSTAR JUNIOR (5x5)
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:47
- Speed:25MHz
- E E P R O M Size:-
- Core Processor:MSP430 CPUXV2
- R A M Size:8K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Program Memory Size:96KB (96K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:A/D 12x12b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MSP430F5326IZQE provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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