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Texas Instruments MSP430F435IPN

Name: MSP430F435IPN
Brand: Texas Instruments
SKU: MSP430F435IPN-DS
Price: 1.9521 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 10815

MOQ: 1

7 Price Tiers

Mfr.Part # :MSP430F435IPN
Manufacturer :Texas Instruments
Dasenic # :MSP430F435IPN-DS
Datasheet : MSP430F435IPN Datasheet PDF
Description : IC MCU 16BIT 16KB FLASH 80LQFP
Package :-
Unit Price: $1.9521
Total: $1.95

Quantity	Unit Price	You Save
1-1	$1.9521	-
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Texas Instruments MSP430F435IPN technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules

Product Status:Active

Operating Temperature:-40°C ~ 85°C (TA)

Mounting Type:Surface Mount

Package / Case:80-LQFP

Supplier Device Package:80-LQFP (12x12)

Peripherals:Brown-out Detect/Reset, LCD, POR, PWM, WDT

Number of I/ O:48

Speed:8MHz

E E P R O M Size:-

Core Processor:MSP430 CPU16

R A M Size:512 x 8

Program Memory Type:Flash

Core Size:16-Bit

Connectivity:SPI, UART/USART

Program Memory Size:16KB (16K x 8 + 256B)

Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V

Data Converters:A/D 8x12b

Oscillator Type:Internal

EU RoHS Status:RoHS Compliant

REACH Status:Vendor is not defined

US ECCN:Provided as per user requirements

China RoHS Status:Green Symbol: Green and environmentally friendly product

MSP430F435IPN provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.