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Texas Instruments MSP430F2619CY
PROTOTYPE
Manufacturer # :MSP430F2619CY
Manufacturer :Texas Instruments
Dasenic # :MSP430F2619CY-DS
Datasheet :
MSP430F2619CY Datasheet
MSP430F2619CY DatasheetCustomer # :
Description : PROTOTYPE
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| Quantity | Unit Price | Total |
| 1+ | $ 89.9910 | $ 89.99 |
In Stock: 1748
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 89.991
Total :$ 89.99
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Payment :
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MSP430F2619CY information
Texas Instruments MSP430F2619CY technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:48
- Speed:16MHz
- Core Processor:MSP430™
- R A M Size:4K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Program Memory Size:120KB (120K x 8 + 256B)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:A/D 8x12b
- Oscillator Type:Internal
- Series:MSP430F2xx
- Packaging:Bulk
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430F2619CY provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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