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  • Texas Instruments MAX3227ECDBR

    IC TRANSCEIVER FULL 1/1 16SSOP
  • part number has RoHS
  • Mfr.Part # :MAX3227ECDBR
  • Manufacturer :Texas Instruments
  • Dasenic # :MAX3227ECDBR-DS
  • Datasheet :pdf download MAX3227ECDBR Datasheet
  • Description : IC TRANSCEIVER FULL 1/1 16SSOP
  • Package :-
  • Quantity :
    Unit Price : $ 1.116Total : $ 1.12
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 6526
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 1.1160$ 1.12
10 +$ 0.9900$ 9.90
50 +$ 0.9810$ 49.05
100 +$ 0.9360$ 93.60

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Texas Instruments MAX3227ECDBR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Drivers, Receivers, Transceivers
Product Status:Active
Operating Temperature:0°C ~ 70°C
Mounting Type:Surface Mount
Package / Case:16-SSOP (0.209", 5.30mm Width)
Type:Transceiver
Supplier Device Package:16-SSOP
Voltage - Supply:3V ~ 5.5V
Protocol:RS232
Number of Drivers/ Receivers:1/1
Duplex:Full
Receiver Hysteresis:500 mV
Data Rate:1Mbps
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX3227ECDBR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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