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Texas Instruments MAX232ECNE4
Manufacturer # :MAX232ECNE4
Manufacturer :Texas Instruments
Dasenic # :MAX232ECNE4-DS
Datasheet : MAX232ECNE4 Datasheet
Customer # :
Description : 5-V DUAL CHANNEL 250KBPS RS-232
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In Stock: 664
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.6714
Total :$ 2.67
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MAX232ECNE4 information
Texas Instruments MAX232ECNE4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Type:Transceiver
- Supplier Device Package:16-PDIP
- Voltage - Supply:4.5V ~ 5.5V
- Protocol:RS232
- Number of Drivers/ Receivers:2/2
- Duplex:Full
- Receiver Hysteresis:500 mV
- Data Rate:250kbps
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX232ECNE4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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