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Texas Instruments M38510/30701SEA
Manufacturer # :M38510/30701SEA
Manufacturer :Texas Instruments
Dasenic # :M38510/30701SEA-DS
Datasheet : M38510/30701SEA Datasheet
Customer # :
Description : 3-Line to 8-Line Decoders/Demultiplexers
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In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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M38510/30701SEA information
Texas Instruments M38510/30701SEA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:16-CDIP (0.300", 7.62mm)
- Type:Decoder/Demultiplexer
- Supplier Device Package:16-CDIP
- Voltage - Supply:4.5V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:400µA, 4mA
- Circuit:1 x 3:8
- Independent Circuits:1
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
M38510/30701SEA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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