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Texas Instruments LMZM23601V5SILR
Manufacturer # :LMZM23601V5SILR
Manufacturer :Texas Instruments
Dasenic # :LMZM23601V5SILR-DS
Datasheet : LMZM23601V5SILR Datasheet
Customer # :
Description : DC DC CONVERTER 5V 10-LDFN Exposed Pad, Module
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6480
MOQ :1 PCS
Packaging :10-LDFN Exposed Pad, Module
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.157
Total :$ 5.16
Delivery :
Payment :
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LMZM23601V5SILR information
Texas Instruments LMZM23601V5SILR technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Features:OCP, SCP, UVLO
- Mounting Type:Surface Mount
- Package / Case:10-LDFN Exposed Pad, Module
- Size / Dimension:0.15" L x 0.12" W x 0.06" H (3.8mm x 3.0mm x 1.6mm)
- Approval Agency:-
- Type:Non-Isolated PoL Module
- Voltage - Input ( Max):36V
- Supplier Device Package:10-uSIP (3.8x3)
- Power ( Watts):-
- Number of Outputs:1
- Voltage - Isolation:-
- Control Features:-
- Current - Output ( Max):1A
- Voltage - Input ( Min):4V
- Voltage - Output 1:5V
- Voltage - Output 2:-
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:87%
- Standard Number:-
- Applications:ITE (Commercial)
LMZM23601V5SILR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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