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Texas Instruments LMV822IDG4
IC OPAMP GP 2 CIRCUIT 8SOIC
Manufacturer # :LMV822IDG4
Manufacturer :Texas Instruments
Dasenic # :LMV822IDG4-DS
Datasheet :
LMV822IDG4 Datasheet
LMV822IDG4 DatasheetCustomer # :
Description : IC OPAMP GP 2 CIRCUIT 8SOIC
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| Quantity | Unit Price | Total |
| 10+ | $ 1.1165 | $ 11.17 |
| 825+ | $ 0.9304 | $ 767.58 |
In Stock: 2597
MOQ :1 PCS
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Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 1.1165
Total :$ 1.12
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LMV822IDG4 information
Texas Instruments LMV822IDG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Current - Supply:500µA
- Output Type:Rail-to-Rail
- Supplier Device Package:8-SOIC
- Number of Circuits:2
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:45 mA
- Slew Rate:1.9V/µs
- Gain Bandwidth Product:5.5 MHz
- Current - Input Bias:40 nA
- Voltage - Input Offset:1 mV
- Voltage - Supply Span ( Min):2.5 V
- Voltage - Supply Span ( Max):5.5 V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LMV822IDG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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