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Texas Instruments LMH6503MAX
Manufacturer # :LMH6503MAX
Manufacturer :Texas Instruments
Dasenic # :LMH6503MAX-DS
Datasheet : LMH6503MAX Datasheet
Customer # :
Description : IC VARIABLE GAIN 1 CIRC 14SOIC 14-SOIC (0.154", 3.90mm Width)
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1967
MOQ :1 PCS
Packaging :14-SOIC (0.154", 3.90mm Width)
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.2532
Total :$ 17.25
Delivery :
Payment :
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LMH6503MAX information
Texas Instruments LMH6503MAX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Current - Supply:37mA
- Output Type:-
- Supplier Device Package:14-SOIC
- Number of Circuits:1
- Amplifier Type:Variable Gain
- -3db Bandwidth:135 MHz
- Current - Output / Channel:90 mA
- Slew Rate:1800V/µs
- Gain Bandwidth Product:-
- Current - Input Bias:11 µA
- Voltage - Input Offset:-
- Voltage - Supply Span ( Min):5 V
- Voltage - Supply Span ( Max):12 V
LMH6503MAX provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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