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Texas Instruments LMG3526R030RQST
Manufacturer # :LMG3526R030RQST
Manufacturer :Texas Instruments
Dasenic # :LMG3526R030RQST-DS
Datasheet : LMG3526R030RQST Datasheet
Customer # :
Description : 650-V 30-mΩ GaN FET with integrated driver, protection and zero-voltage detection
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In Stock: 1750
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.693
Total :$ 27.69
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LMG3526R030RQST information
Texas Instruments LMG3526R030RQST technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Power Driver Modules
- Product Status:Active
- Mounting Type:Surface Mount, Wettable Flank
- Package / Case:52-VQFN Exposed Pad
- Type:MOSFET
- Configuration:Half Bridge Inverter
- Voltage:650 V
- Current:55 A
- Packaging:Tape & Reel (TR)
- Packaging:Cut Tape (CT)
- Packaging:Dasenic-Reel®
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMG3526R030RQST provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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