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Texas Instruments LMG3425R050RQZR
Manufacturer # :LMG3425R050RQZR
Manufacturer :Texas Instruments
Dasenic # :LMG3425R050RQZR-DS
Datasheet : LMG3425R050RQZR Datasheet
Customer # :
Description : 600-V 50-mΩ GaN FET with integrated driver, protection, temperature reporting and ideal diode mode
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In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.558
Total :$ 18.56
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LMG3425R050RQZR information
Texas Instruments LMG3425R050RQZR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Features:Bootstrap Circuit, Latch Function, Slew Rate Controlled
- Application:General Purpose
- Package / Case:54-VQFN Exposed Pad
- Technology:MOSFET (Metal Oxide)
- Interface:PWM
- Operating Temperature:-40°C ~ 150°C (TJ)
- Voltage- Supply:7.5V ~ 18V
- Fault Protection:Over Current, Over Temperature, UVLO
- Output Configuration:Half Bridge
- Load Type:Inductive, Capacitive, Resistive
- Rds On( Typ):43mOhm
- Voltage- Load:7.5V ~ 18V
- Current- Peak Output:1.2A
- Current- Output/ Channel:1.2A
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMG3425R050RQZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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