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  • Texas Instruments LMG3425R030RQZT

    600-V 30-M GAN FET WITH INTEGRAT
  • part number has RoHS
  • Mfr.Part # :LMG3425R030RQZT
  • Manufacturer :Texas Instruments
  • Dasenic # :LMG3425R030RQZT-DS
  • Datasheet :pdf download LMG3425R030RQZT Datasheet
  • Description : 600-V 30-M GAN FET WITH INTEGRAT
  • Package :-
  • Quantity :
    Unit Price : $ 26.703Total : $ 26.70
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1891
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 26.7030$ 26.70
10 +$ 21.2490$ 212.49
25 +$ 20.2860$ 507.15
100 +$ 18.1440$ 1814.40
250 +$ 17.0280$ 4257.00

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Texas Instruments LMG3425R030RQZT technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Full, Half-Bridge Drivers
Product Status:Active
Operating Temperature:-40°C ~ 150°C (TJ)
Features:-
Mounting Type:Surface Mount
Package / Case:54-VQFN Exposed Pad
Technology:-
Interface:Logic, PWM
Supplier Device Package:54-VQFN (12x12)
Voltage - Supply:7.5V ~ 18V
Current - Output / Channel:1.2A
Current - Peak Output:1.2A
Fault Protection:Over Current, Over Temperature, UVLO
Output Configuration:Half Bridge
Load Type:Inductive
Rds On ( Typ):35mOhm
Voltage - Load:7.5V ~ 18V
Applications:General Purpose
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
LMG3425R030RQZT provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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