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Texas Instruments LMG3425R030RQZR
Manufacturer # :LMG3425R030RQZR
Manufacturer :Texas Instruments
Dasenic # :LMG3425R030RQZR-DS
Datasheet : LMG3425R030RQZR Datasheet
Customer # :
Description : 600-V 30-mΩ GaN FET with integrated driver, protection, temperature reporting and ideal diode mode
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In Stock: 555
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 42.6959
Total :$ 42.70
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LMG3425R030RQZR information
Texas Instruments LMG3425R030RQZR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Application:General Purpose
- Mounting Type:Surface Mount
- Package / Case:54-VQFN Exposed Pad
- Interface:Logic, PWM
- Supplier Device Package:54-VQFN (12x12)
- Voltage - Supply:7.5V ~ 18V
- Current - Output / Channel:1.2A
- Current - Peak Output:1.2A
- Fault Protection:Over Current, Over Temperature, UVLO
- Output Configuration:Half Bridge
- Load Type:Inductive
- Rds On ( Typ):35mOhm
- Voltage - Load:7.5V ~ 18V
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMG3425R030RQZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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