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  • Texas Instruments LMG2610RRGR

    650-V 170/248-mΩ GaN half-bridge for ACF with integrated driver, protection and current sense
  • part number has RoHS
  • Mfr.Part # :LMG2610RRGR
  • Manufacturer :Texas Instruments
  • Dasenic # :LMG2610RRGR-DS
  • Datasheet :pdf download LMG2610RRGR Datasheet
  • Description : 650-V 170/248-mΩ GaN half-bridge for ACF with integrated driver, protection and current sense
  • Package :-
  • Quantity :
    Unit Price : $ 10.818Total : $ 10.82
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 5832
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 10.8180$ 10.82
10 +$ 8.4960$ 84.96
25 +$ 7.9110$ 197.78
100 +$ 7.2720$ 727.20
250 +$ 6.9660$ 1741.50

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Texas Instruments LMG2610RRGR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Full, Half-Bridge Drivers
Product Status:Active
Series:*
Packaging:Tape & Reel (TR)
Packaging:Cut Tape (CT)
Packaging:Dasenic-Reel®
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Affected
US ECCN:EAR99
HTS US:8542.39.0001
EU RoHS Status:RoHS Compliant
China RoHS Status:Green Symbol: Green and environmentally friendly product
LMG2610RRGR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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