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Texas Instruments LMD18200-2D/883
Manufacturer # :LMD18200-2D/883
Manufacturer :Texas Instruments
Dasenic # :LMD18200-2D/883-DS
Datasheet : LMD18200-2D/883 Datasheet
Customer # :
Description : 2.4A, 55V H-Bridge
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In Stock: 7899
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 9.5148
Total :$ 9.51
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LMD18200-2D/883 information
Texas Instruments LMD18200-2D/883 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Active
- Application:General Purpose
- Package / Case:24-CDIP (0.600, 15.24mm) Window
- Technology:Bi-CMOS, DMOS
- Functions:Driver - Fully Integrated, Control and Power Stage
- Interface:Parallel
- Mounting Type:Through Hole
- Operating Temperature:-55°C ~ 125°C (TJ)
- Voltage- Supply:12V ~ 55V
- Current- Output:3A
- Output Configuration:Low Side (2)
- Voltage- Load:12V ~ 55V
- Motor Type- A C D C:Brushed DC
- Motor Type- Stepper:Bipolar
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMD18200-2D/883 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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