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  • Texas Instruments LMC6762AIMX/NOPB

    IC COMPAR DUAL MICPWR CMOS 8SOIC
  • part number has RoHS
  • Mfr.Part # :LMC6762AIMX/NOPB
  • Manufacturer :Texas Instruments
  • Dasenic # :LMC6762AIMX/NOPB-DS
  • Datasheet :pdf download LMC6762AIMX/NOPB Datasheet
  • Description : IC COMPAR DUAL MICPWR CMOS 8SOIC
  • Package :-
  • Quantity :
    Unit Price : $ 0.945Total : $ 0.94
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 12753
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.9450$ 0.95
10 +$ 0.9360$ 9.36
50 +$ 0.9270$ 46.35

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Texas Instruments LMC6762AIMX/NOPB technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Comparators Linear
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.154", 3.90mm Width)
Type:General Purpose
Output Type:Push-Pull, Rail-to-Rail
Supplier Device Package:8-SOIC
Number of Elements:2
Voltage - Supply, Single/ Dual (±):2.7V ~ 15V, ±1.35V ~ 7.5V
Voltage - Input Offset ( Max):5mV @ 5V
Current - Input Bias ( Max):0.04pA @ 5V
Current - Output ( Typ):30mA
Current - Quiescent ( Max):20µA
C M R R, P S R R ( Typ):75dB CMRR, 80dB PSRR
Propagation Delay ( Max):10µs
Hysteresis:-
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
LMC6762AIMX/NOPB provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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