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Texas Instruments LM5115AMT
Manufacturer # :LM5115AMT
Manufacturer :Texas Instruments
Dasenic # :LM5115AMT-DS
Datasheet : LM5115AMT Datasheet
Customer # :
Description : IC SECONDARY SIDE CTRLR 16TSSOP
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In Stock: 1878
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.9132
Total :$ 4.91
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LM5115AMT information
Texas Instruments LM5115AMT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Supply Controllers, Monitors
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Current - Supply:4 mA
- Voltage - Input:5V ~ 30V
- Supplier Device Package:16-TSSOP
- Voltage - Supply:5V ~ 7.5V
- Applications:Secondary-Side Controller
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM5115AMT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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