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Texas Instruments LM5110-2SDX
Manufacturer # :LM5110-2SDX
Manufacturer :Texas Instruments
Dasenic # :LM5110-2SDX-DS
Datasheet : LM5110-2SDX Datasheet
Customer # :
Description : IC GATE DRVR LOW-SIDE 10WSON
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In Stock: 9031
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.009
Total :$ 0.01
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LM5110-2SDX information
Texas Instruments LM5110-2SDX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:10-WDFN Exposed Pad
- Input Type:Inverting
- Supplier Device Package:10-WSON (4x4)
- Voltage - Supply:3.5V ~ 14V
- Channel Type:Independent
- Driven Configuration:Low-Side
- Number of Drivers:2
- Gate Type:N-Channel MOSFET
- Logic Voltage - V I L, V I H:0.8V, 2.2V
- Current - Peak Output ( Source, Sink):3A, 5A
- High Side Voltage - Max ( Bootstrap):-
- Rise / Fall Time ( Typ):14ns, 12ns
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM5110-2SDX provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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