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Texas Instruments LM3S9D96-IBZ80-A1T
Manufacturer # :LM3S9D96-IBZ80-A1T
Manufacturer :Texas Instruments
Dasenic # :LM3S9D96-IBZ80-A1T-DS
Datasheet : LM3S9D96-IBZ80-A1T Datasheet
Customer # :
Description : IC MCU 32BIT 512KB FLASH 108BGA
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In Stock: 13
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 15.4836
Total :$ 15.48
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LM3S9D96-IBZ80-A1T information
Texas Instruments LM3S9D96-IBZ80-A1T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:108-LFBGA
- Supplier Device Package:108-BGA (10x10)
- Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Number of I/ O:65
- Speed:80MHz
- Core Processor:ARM® Cortex®-M3
- R A M Size:96K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
- Program Memory Size:512KB (512K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.235V ~ 1.365V
- Data Converters:A/D 16x12b
- Oscillator Type:Internal
- Series:Stellaris® ARM® Cortex®-M3S 9000
- Base Product Number:LM3S9D96
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM3S9D96-IBZ80-A1T provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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