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Texas Instruments LM3S2620-IBZ25-A2T
Manufacturer # :LM3S2620-IBZ25-A2T
Manufacturer :Texas Instruments
Dasenic # :LM3S2620-IBZ25-A2T-DS
Datasheet : LM3S2620-IBZ25-A2T Datasheet
Customer # :
Description : IC MCU 32BIT 128KB FLASH 108BGA
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In Stock: 692
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 39.5651
Total :$ 39.57
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LM3S2620-IBZ25-A2T information
Texas Instruments LM3S2620-IBZ25-A2T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Not For New Designs
- Package / Case:108-LFBGA
- Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
- Speed:25MHz
- Connectivity:CANbus, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Series:Stellaris® ARM® Cortex®-M3S 2000
- Operating Temperature:-40°C ~ 85°C (TA)
- Core Processor:ARM® Cortex®-M3
- R A M Size:32K x 8
- Numberof I/ O:52
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Oscillator Type:Internal
- Program Memory Size:128KB (128K x 8)
- Voltage- Supply( Vcc/ Vdd):2.25V ~ 2.75V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM3S2620-IBZ25-A2T provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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