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Texas Instruments LM22676MR-ADJ/S7002530
Manufacturer # :LM22676MR-ADJ/S7002530
Manufacturer :Texas Instruments
Dasenic # :LM22676MR-ADJ/S7002530-DS
Datasheet : LM22676MR-ADJ/S7002530 Datasheet
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Description : IC REG BUCK ADJ 3A 8SOPWR
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In Stock: 1210
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Total :$ 0.00
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LM22676MR-ADJ/S7002530 information
Texas Instruments LM22676MR-ADJ/S7002530 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Regulators
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:8-PowerSOIC (0.154", 3.90mm Width)
- Output Type:Adjustable
- Voltage - Input ( Max):42V
- Functions:Step-Down
- Supplier Device Package:8-SO PowerPad
- Current - Output:3A
- Frequency - Switching:500kHz
- Number of Outputs:1
- Topology:Buck
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):1.285V
- Voltage - Output ( Max):37V
- Synchronous Rectifier:No
- Voltage - Input ( Min):4.5V
- Series:SIMPLE SWITCHER®
- Packaging:Bulk
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM22676MR-ADJ/S7002530 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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